Transfer the SERDP technology developed in the areas of lead-free solder behavior, tin whisker growth and whisker mitigation to the DOD acquisition community program managers and systems engineers. The aim is to motivate appropriate lead-free control requirement flow down in systems management plans to lower use and sustainment risks associated with lead-free assembly adoption. Dr. Meschter (BAE Systems), Dr. Borgesen (Binghamton University), Dr. Dutta (Washington State University) and Dr. Osterman (University of Maryland) are the Co-Investigators developing the knowledge transfer materials.
Three knowledge transfer methods will be used (1) webinars, (2) transfer of the tin whisker risk calculator to the University of Maryland Center for Advanced Life Cycle Engineering (CALCE), and (3) providing proposed updates to industry standards being developed and maintained by the IPC Lead (Pb)-free Electronics Risk Management Council.
Research Transfer to ICP-PERM Group Documents GEIA-STD-0005-XX:
Educate DOD program managers and systems engineers with flexible, low travel cost knowledge transfer options, improve speed of SERDP transfer by embedding SERDP knowledge in existing maintained University of Maryland Center for Advanced Life Cycle Engineering (CALCE) reliability tools used by its DOD Membership, improve procurement by enhancing standards available to weapons system platforms to manage lead-free material risk in aerospace and defense (A&D) systems. The transfer to the DOD industrial base is expected to be rapid and robust through the IPC-Pb-free Electronics Risk Management (IPC-PERM) council and the CALCE membership ranks. The team will reach out to the DOD personnel participating in the IPC-PERM before severe travel and budget restrictions are encountered. We also have the opportunity to work directly with interested military program managers and systems engineers to capitalize on the lead-free research findings in order to benefit the product lines for the Warfighter.