Enabling Lead-Free Interconnects in DoD Weapon Systems

WP-201573-T2

Objective

Transfer the SERDP technology developed in the areas of lead-free solder behavior, tin whisker growth and whisker mitigation to the DOD acquisition community program managers and systems engineers. The aim is to motivate appropriate lead-free control requirement flow down in systems management plans to lower use and sustainment risks associated with lead-free assembly adoption.  Dr. Meschter (BAE Systems), Dr. Borgesen (Binghamton University), Dr. Dutta (Washington State University) and Dr. Osterman (University of Maryland) are the Co-Investigators developing the knowledge transfer materials.

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Technology Description

Three knowledge transfer methods will be used (1) webinars, (2) transfer of the tin whisker risk calculator to the University of Maryland Center for Advanced Life Cycle Engineering (CALCE), and (3) providing proposed updates to industry standards being developed and maintained by the IPC Lead (Pb)-free Electronics Risk Management Council.

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Interim Results

Research Transfer to ICP-PERM Group Documents GEIA-STD-0005-XX:

  • Briefings completed at the Pb-Free Electronics Risk Management (PERM) Council Meeting No. 30 , 2 - 4 November 2016 Harris Technology Center
    • P. Borgesen and I. Dutta
      • Output of WP1751: Outline of recommended paragraphs to be considered for updating in GEIA-HB-0005-2 and GEIA-STD-0005-3 and the detailed recommended updates to GEIA-HB-0005-2
      • No-Pb Solder Reliability ESTCP webinar preview
    • S. Meschter and M. Osterman
    • SERDP/ESTCP Tin whisker risk calculator during the 8-81H Tin whiskers group working session
  • GEIA-STD-0005-2 Appendix information added corrosion induced whisker formation developed during WP1753
  • IPC-PERM Council Coordination for GEIA-HB-0005-2 (Technical Guidelines) or GEIA-STD-0005-3 (Test Standard)
    • Currently managing manpower limitations, few DoD participants
      • Teams are working on
        • Lead-free design guide
        • Test Vehicle Evaluation Project  
        • Solder self-mitigation for tin whiskers
        • State of the industry for conformal coating coverage
        • Guidelines for Pb-free BGAs Reballing vs. Mixed Alloy Soldering
        • Tin whiskers users group
        • Updating GEIA-STD-0005-1 Performance requirements for using Lead-free solder
        • Updating GEIA-STD-0005-2 Tin whisker mitigation
    • Neither the GEIA-HB-0005-2 or GEIA-STD-0005-3 has a team available for document revision
      • Resources may become available in 2018
      • Reviewing the GEIA-HB-0005-2 change needs during PERM 34 Nov. 7-9, 2017 at Phillips Medical.

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Benefits

Educate DOD program managers and systems engineers with flexible, low travel cost knowledge transfer options, improve speed of SERDP transfer by embedding SERDP knowledge in existing maintained University of Maryland Center for Advanced Life Cycle Engineering (CALCE) reliability tools used by its DOD Membership, improve procurement by enhancing standards available to weapons system platforms to manage lead-free material risk in aerospace and defense (A&D) systems. The transfer to the DOD industrial base is expected to be rapid and robust through the IPC-Pb-free Electronics Risk Management (IPC-PERM) council and the CALCE membership ranks. The team will reach out to the DOD personnel participating in the IPC-PERM before severe travel and budget restrictions are encountered. We also have the opportunity to work directly with interested military program managers and systems engineers to capitalize on the lead-free research findings in order to benefit the product lines for the Warfighter.

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Points of Contact

Principal Investigator

Dr. Stephan Meschter

BAE Systems

Phone: 607-429-8828

Fax: 607-755-6615

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